Principal Packaging Engineer, Optical Interfaces

About Us:

nEye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. nEye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability.

Job Overview:

This role is for a highly skilled and experienced Principal Packaging Design Engineer to lead the development of our next-generation silicon photonics packaging solutions. You will be the primary architect of our optical interfacing processes, ensuring high performance and exceptional reliability. You will own the entire process, from the collaborative design of the optical and mechanical structures to process implementation and optimization with our contract manufacturing partners.

This is a hands-on technical position requiring a deep understanding of precision optical assembly. You will work closely with our integrated circuit (IC) design, mechanical, and reliability teams to create robust, manufacturable packaging solutions. Your expertise will be vital for pushing the boundaries of fiber-to-chip coupling efficiency, mechanical stability, and long-term product reliability.